Suzhou Bopai Semiconductor Technology Co., Ltd. is a high-tech innovator and manufacturer of semiconductor technology, promoting the industrial development of power semiconductors, advanced packaging technology and new energy applications. With the world's leading core technology accumulation, absorbing advanced SiC power semiconductor packaging technology and AMB copper-clad ceramic substrate technology and technology, BOPAI Group is committed to becoming a supplier of innovative and high-quality solutions for the global electronic semiconductor industry.
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Total global sales of semiconductor manufacturing equipment by OEMs are expected to reach a record $117.5 billion in 2022, up 14.7% from $102.5 billion in 2021, and are expected to increase to $120.8 billion in 2023, the report noted.
The 2022 China Semiconductor Packaging and Testing Annual Conference is hosted by the Packaging Branch of the China Semiconductor Industry Association, and jointly organized by the Packaging Branch and the rotating chairman unit of the Packaging Branch. It has been successfully held for 19 sessions across the country.
One of the international exhibitions and seminars focusing on the field of power electronics, based on the industry for more than 20 years
