Bopai Semiconductor Technology Co., Ltd is a global leading enterprise focusing on advanced semiconductor packaging, high-power module packaging and applications, and Bopai occupies a great number of core patents of silver sintering, film assisted molding (FAM), Dynamic Insert Technology, Through Polymer Via (TPV), etc. In the segments such as MEMS and sensors, our related equipment can meet the special process requirements of optical/pressure/image sensors, fingerprint recognition sensors, smart cards and 2.5D/3D products.
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Total global sales of semiconductor manufacturing equipment by OEMs are expected to reach a record $117.5 billion in 2022, up 14.7% from $102.5 billion in 2021, and are expected to increase to $120.8 billion in 2023, the report noted.
The 2022 China Semiconductor Packaging and Testing Annual Conference is hosted by the Packaging Branch of the China Semiconductor Industry Association, and jointly organized by the Packaging Branch and the rotating chairman unit of the Packaging Branch. It has been successfully held for 19 sessions across the country.
One of the international exhibitions and seminars focusing on the field of power electronics, based on the industry for more than 20 years
