(Quasi) monolithic integration (System in Package or SIP) is an ongoing trend to increase functionality and reduce cost. This includes technologies such as the integration of multiple active and passive (pre-packaged) components into one over-mold package, die-stacking and package stacking. A high level of customization is necessary when developing these kind of packages. Boschman is currently also developing a new technology (through polymer vias) that holds great promise for stacking and multi