AMB copper-clad ceramic substrate: AMB (Active Metal Bonding) for short, is active metal brazing copper-clad technology, relying on active metal solder to achieve high-temperature metallurgical bonding of aluminum nitride and oxygen-free copper, with high bonding strength, It has attracted much attention due to its advantages such as good cooling and heating cycle reliability, and its application prospects are extremely broad.

Nantong Wespell Semiconductor Technology Co., Ltd. is an enterprise specializing in the R&D and manufacturing of copper clad ceramic substrate technology, and is committed to becoming the world's leading supplier of copper clad ceramic substrates.