Silver sintering is a proven die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. It provides both high yield and high reliability.

Through Polymer Via (TPV) is a patented technology to create high-density high-aspect ratio electrical and/or optical inter-connections through (transfer-molding) package encapsulation.

FAM is a cluster of unique technologies using films in the mold before the products to be encapsulated by means of transfer molding. This results in improved package quality.

Dynamic Insert Technology (DIT) is a patented technology that has been developed to further optimize the performance of FAM to automatically and dynamically control pressure.

The AMB active metal brazing process uses a small amount of active elements (currently commonly used Ti) contained in the brazing filler metal to react with the surface of the ceramic to form a reaction layer that can be wetted with the liquid brazing filler metal, thereby realizing the bonding of ceramics and metals. A method, its performance Reliability metrics largely depend on the solder used for brazing.