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Home
About Us
Solutions
Power Modules & Packages
Optical Packages
2.5D/3D Packages
Smart Cards
Mems & Sensors
Products
Package Development
Assembly Services
Production Equipment
AMB
Ceramic substrate
Key Tech& Service
Our Key Technologies
Application Laboratory Centers
Industrial Areas
Download Center
News Center
Industry News
Group News
Marketing Activity
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HR Policy
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Contact Us
CN
Key Tech& Service
Sustainability and Innovation is our pursuit
Our Key Technologies
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Bopaisemi
Boschman
Ag-sintering-technologi
1.76(MB)
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Package-Development
1.34(MB)
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Reel-to-Reel-Molding-technolog
1.80(MB)
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Sintertool-solutions
5.52(MB)
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Winspower
Winspower Ceramic Substrates-AMB Design Rules
0.31(MB)
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Bosonmaterial