Production Equipment

Sustainability and Innovation is our pursuit

Our technology enables revolutionary solutions

BOPAiSEMI specializes in the development and supply of advanced transfer molding and sintering systems for electronic assembly industries across the globe. We offer added-value encapsulation and bonding process and equipment solutions for a wide range of packages.
Production Equipment

Our Service

IMG IMG

Ag-Sintering

Silver sintering is a die attach technology offering a void-free and strong bond with high thermal and electrical conductivity. Resulting in high yield and high reliability.

IMG IMG

Film Assisted Molding (FAM)

Film Assisted Molding is a cluster of unique technologies using double films in the mold before the lead frames to be encapsulated. Resulting in improved package quality.

IMG IMG

Reel-to-Reel

Creating the highest productivity by Reel-to-reel molding which is largely determined by effective mold length and machine time. Resulting in high precision mold tooling.

Our Products

Sinterstar Series

For pressurized Ag Sintering, we have solutions for R&D, Low-Medium and High volume environment available.

Unistar Series

For Film Assisted transfer Molding, we have solutions for R&D, Low-Medium and High volume environment available.

Reelstar Series

Transfer molding solutions for Reel-to-Reel applications.

Our satisfied clients can be found in the following industries:

Our application areas