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Home
About
Solutions
Power Modules & Packages
Optical Packages
2.5D/3D Packages
Smart Cards
Mems & Sensors
Products
Package Development
Assembly Services
Production Equipment
AMB
Key Tech& Service
Our Key Technologies
Application Laboratory Centers
Industrial Areas
Download Center
News Center
Industry News
Group News
Marketing Activity
Careers
HR Policy
Talent Recruitment
Contact
CN
About
Guarantee the continuous success of customers with technological innovation and team development, thereby realizing shareholder returns and employee value
Group Profile
Vision&Mission
Group Policy
Group Milestone
Group Milestone
2022
Suzhou innovation and application centre opened
2021
Established Boschman Suzhou Branch
Launch of Sinterstar-Mini
Start the Powerstar Project
2020
Winspower founded
Cleanroom Expansion Phase 1
Obtained FBG Patent
Launched HV Molding Platform
2019
Obtained MCE Patent
Launched Sinterstar-Research
2018
Start the Power Strategic Project
Boschman new branding
2017
Set up Assembly Service Department
2016
The first micro assembly line
Launched TPV Technology
2015
Start a large OEM Power Project
Acquired CLIP patent
First automatic Sinterstar Launched
2014
Obtained DIT Patent
Launch of the Sinterstar Series
2013
Obtained TPV patent
Launch of Reelstar Molding Series
2010
Established APC Design Center
2007
Launch of Unistar Molding System
2003
Launch of R2R Molding System
2001
Launch of the Flexstar Molding system
1997
Established Boschman Singapore branch
1992
Launch of Packstar Molding System
1987
Boschman Found